LOCTITE® 3129
功能与优点
LOCTITE 3129, Epoxy, Bonding heat sensitive components
LOCTITE® 3129 is a one part, heat curable epoxy. This product is designed to cure at low temperature and gives excellent adhesion on a wide range of materials in considerably short time. Typical applications include Memory cards, CCD/CMOS Assemblies. Particularly suited where low curing temperatures are required for heat sensitive components.
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技术信息
| 储存温度 | -15.0 - -25.0 °C |
| 剪切强度 | 2230.0 psi |
| 卡森粘度，锥型和板型，Haake PK100、PK1，2°, @ 25.0 °C | 4200.0 mPa.s (cP) |
| 固化方式 | 热+紫外线 |
| 固化时间, @ 80.0 °C | 5.0 - 10.0 分钟 |
| 屈服值 | 39000.0 mPa·s |
| 粘度，锥型和板型，Haake PK100、PK1，2°, @ 25.0 °C Shear Rate 2 s⁻¹ | 46000.0 mPa.s (cP) |
| 粘度，锥型和板型，Haake PK100、PK1，2°, @ 25.0 °C Shear Rate 20 s⁻¹ | 12000.0 mPa.s (cP) |
| 组分数量 | 单组份 |
LOCTITE® 3129
LOCTITE 3129, Epoxy, Bonding heat sensitive components