LOCTITE® 3129
Vlastnosti a výhody
LOCTITE 3129, Epoxy, Bonding heat sensitive components
LOCTITE® 3129 is a one part, heat curable epoxy. This product is designed to cure at low temperature and gives excellent adhesion on a wide range of materials in considerably short time. Typical applications include Memory cards, CCD/CMOS Assemblies. Particularly suited where low curing temperatures are required for heat sensitive components.
Oblasti Použití
Technické informace
| Casson viskozita, kužel & deska Haake PK100, PK1, 2°, @ 25.0 °C | 4200.0 mPa.s (cP) |
| Mez kluzu | 39000.0 mPa·s |
| Pevnost ve střihu | 2230.0 psi |
| Plán vytvrzení, @ 80.0 °C | 5.0 - 10.0 min. |
| Počet složek | 1 složka |
| Teplota skladování | -15.0 - -25.0 °C |
| Viskozita, kužel & deska Haake PK100, PK1, 2°, @ 25.0 °C Shear Rate 2 s⁻¹ | 46000.0 mPa.s (cP) |
| Viskozita, kužel & deska Haake PK100, PK1, 2°, @ 25.0 °C Shear Rate 20 s⁻¹ | 12000.0 mPa.s (cP) |
| Způsob vytvrzování | Vytvrzování teplem |
LOCTITE® 3129
LOCTITE 3129, Epoxy, Bonding heat sensitive components