LOCTITE® 3129

Características y Ventajas

LOCTITE 3129, Epoxy, Bonding heat sensitive components
LOCTITE® 3129 is a one part, heat curable epoxy. This product is designed to cure at low temperature and gives excellent adhesion on a wide range of materials in considerably short time. Typical applications include Memory cards, CCD/CMOS Assemblies. Particularly suited where low curing temperatures are required for heat sensitive components.
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Información técnica

Casson viscosidad, cono & placa Haake PK100, PK1, 2°, @ 25.0 °C 4200.0 mPa.s (cP)
Número de componentes Monocomponente
Programa de curado, @ 80.0 °C 5.0 - 10.0 min
Punto de cedencia 39000.0 mPa·s
Resistencia al corte 2230.0 psi
Temperatura de almacenaje -15.0 - -25.0 °C
Tipo de curado Curado Térmico
Viscosidad, cono & placa Haake PK100, PK1, 2°, @ 25.0 °C Shear Rate 2 s⁻¹ 46000.0 mPa.s (cP)
Viscosidad, cono & placa Haake PK100, PK1, 2°, @ 25.0 °C Shear Rate 20 s⁻¹ 12000.0 mPa.s (cP)