LOCTITE® 3129
Características y Ventajas
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A 1-part, medium viscosity, epoxy that is designed to cure at low temperatures to provide excellent adhesion in 5 to 10 minutes.
LOCTITE® 3129 is a 1-part, heat-curable epoxy. It has been specifically designed to cure at low temperatures to provide excellent adhesion on a wide range of materials in under 10 minutes. It’s ideal where low curing temperatures are required for heat sensitive component, for example in memory cards and CCD/CMOS assemblies.
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Información técnica
| Casson viscosidad, cono & placa Haake PK100, PK1, 2°, @ 25.0 °C | 4200.0 mPa.s (cP) |
| Número de componentes | Monocomponente |
| Programa de curado, @ 80.0 °C | 5.0 - 10.0 min |
| Punto de cedencia | 39000.0 mPa·s |
| Resistencia al corte | 2230.0 psi |
| Temperatura de almacenaje | -15.0 - -25.0 °C |
| Tipo de curado | Curado Térmico |
| Viscosidad, cono & placa Haake PK100, PK1, 2°, @ 25.0 °C Shear Rate 2 s⁻¹ | 46000.0 mPa.s (cP) |
| Viscosidad, cono & placa Haake PK100, PK1, 2°, @ 25.0 °C Shear Rate 20 s⁻¹ | 12000.0 mPa.s (cP) |
LOCTITE® 3129
A 1-part, medium viscosity, epoxy that is designed to cure at low temperatures to provide excellent adhesion in 5 to 10 minutes.