LOCTITE® 3129
Características y Ventajas
LOCTITE 3129, Epoxy, Bonding heat sensitive components
LOCTITE® 3129 is a one part, heat curable epoxy. This product is designed to cure at low temperature and gives excellent adhesion on a wide range of materials in considerably short time. Typical applications include Memory cards, CCD/CMOS Assemblies. Particularly suited where low curing temperatures are required for heat sensitive components.
Leer más
Documentos y Descargas
¿Está buscando un TDS o SDS en otro idioma?
Información técnica
| Casson viscosidad, cono & placa Haake PK100, PK1, 2°, @ 25.0 °C | 4200.0 mPa.s (cP) |
| Número de componentes | Monocomponente |
| Programa de curado, @ 80.0 °C | 5.0 - 10.0 min |
| Punto de cedencia | 39000.0 mPa·s |
| Resistencia al corte | 2230.0 psi |
| Temperatura de almacenaje | -15.0 - -25.0 °C |
| Tipo de curado | Curado Térmico |
| Viscosidad, cono & placa Haake PK100, PK1, 2°, @ 25.0 °C Shear Rate 2 s⁻¹ | 46000.0 mPa.s (cP) |
| Viscosidad, cono & placa Haake PK100, PK1, 2°, @ 25.0 °C Shear Rate 20 s⁻¹ | 12000.0 mPa.s (cP) |
LOCTITE® 3129
LOCTITE 3129, Epoxy, Bonding heat sensitive components