LOCTITE® 3129
Lastnosti in prednosti
LOCTITE 3129, Epoxy, Bonding heat sensitive components
LOCTITE® 3129 is a one part, heat curable epoxy. This product is designed to cure at low temperature and gives excellent adhesion on a wide range of materials in considerably short time. Typical applications include Memory cards, CCD/CMOS Assemblies. Particularly suited where low curing temperatures are required for heat sensitive components.
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Tehnične informacije
| Meja plastičnosti | 39000.0 mPa·s |
| Način strjevanja | Strjevanje na podlagi toplote |
| Strižna trdnost | 2230.0 psi |
| Temperatura skladiščenja | -15.0 - -25.0 °C |
| Urnik strjevanja, @ 80.0 °C | 5.0 - 10.0 min. |
| Viskoznost po Cassonu, stožec in plošča Haake PK100, PK1, 2°, @ 25.0 °C | 4200.0 mPa.s (cP) |
| Viskoznost, stožec in plošča Haake PK100, PK1, 2°, @ 25.0 °C Shear Rate 2 s⁻¹ | 46000.0 mPa.s (cP) |
| Viskoznost, stožec in plošča Haake PK100, PK1, 2°, @ 25.0 °C Shear Rate 20 s⁻¹ | 12000.0 mPa.s (cP) |
| Število komponent | 1 Del |
LOCTITE® 3129
LOCTITE 3129, Epoxy, Bonding heat sensitive components