LOCTITE® 3129
特長および利点
LOCTITE 3129, Epoxy, Bonding heat sensitive components
LOCTITE® 3129 is a one part, heat curable epoxy. This product is designed to cure at low temperature and gives excellent adhesion on a wide range of materials in considerably short time. Typical applications include Memory cards, CCD/CMOS Assemblies. Particularly suited where low curing temperatures are required for heat sensitive components.
詳細はこちら
技術情報
| Casson粘度、コーン＆プレート Haake PK100, PK1, 2°, @ 25.0 °C | 4200.0 mPa.s (cP) |
| せん断強度 | 2230.0 psi |
| 保存温度 | -15.0 - -25.0 °C |
| 形態 | 1液 |
| 硬化スケジュール, @ 80.0 °C | 5.0 - 10.0 分 |
| 硬化タイプ | 熱硬化 |
| 粘度、コーン＆プレート Haake PK100, PK1, 2°, @ 25.0 °C Shear Rate 2 s⁻¹ | 46000.0 mPa.s (cP) |
| 粘度、コーン＆プレート Haake PK100, PK1, 2°, @ 25.0 °C Shear Rate 20 s⁻¹ | 12000.0 mPa.s (cP) |
| 降伏点 | 39000.0 mPa·s |
LOCTITE® 3129
LOCTITE 3129, Epoxy, Bonding heat sensitive components