LOCTITE® 3129
Features and Benefits
LOCTITE 3129, Epoxy, Bonding heat sensitive components
LOCTITE® 3129 is a one part, heat curable epoxy. This product is designed to cure at low temperature and gives excellent adhesion on a wide range of materials in considerably short time. Typical applications include Memory cards, CCD/CMOS Assemblies. Particularly suited where low curing temperatures are required for heat sensitive components.
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Technical Information
| Casson viscosity, cone & plate Haake PK100, PK1, 2°, @ 25.0 °C | 4200.0 mPa·s (cP) |
| Cure schedule, @ 80.0 °C | 5.0 - 10.0 min. |
| Cure type | Heat cure |
| Number of components | 1 part |
| Shear strength | 2230.0 psi |
| Storage temperature | -15.0 - -25.0 °C |
| Viscosity, cone & plate Haake PK100, PK1, 2°, @ 25.0 °C Shear Rate 2 s⁻¹ | 46000.0 mPa·s (cP) |
| Viscosity, cone & plate Haake PK100, PK1, 2°, @ 25.0 °C Shear Rate 20 s⁻¹ | 12000.0 mPa·s (cP) |
| Yield point | 39000.0 mPa·s |
LOCTITE® 3129
LOCTITE 3129, Epoxy, Bonding heat sensitive components