LOCTITE® 3129
특징 및 이점
LOCTITE 3129, Epoxy, Bonding heat sensitive components
LOCTITE® 3129 is a one part, heat curable epoxy. This product is designed to cure at low temperature and gives excellent adhesion on a wide range of materials in considerably short time. Typical applications include Memory cards, CCD/CMOS Assemblies. Particularly suited where low curing temperatures are required for heat sensitive components.
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기술 정보
| 경화 방식 | 열경화 |
| 경화 시간, @ 80.0 °C | 5.0 - 10.0 분 |
| 구성 | 1액형 |
| 저장 온도 | -15.0 - -25.0 °C |
| 전단 강도 | 2230.0 psi |
| 점도, 원뿔 및 평판 Haake PK100, PK1, 2°, @ 25.0 °C Shear Rate 2 s⁻¹ | 46000.0 mPa.s (cP) |
| 점도, 원뿔 및 평판 Haake PK100, PK1, 2°, @ 25.0 °C Shear Rate 20 s⁻¹ | 12000.0 mPa.s (cP) |
| 캐손 점도, 원뿔 및 평판 Haake PK100, PK1, 2°, @ 25.0 °C | 4200.0 mPa.s (cP) |
| 항복점 | 39000.0 mPa·s |
LOCTITE® 3129
LOCTITE 3129, Epoxy, Bonding heat sensitive components