LOCTITE® 3129

Merkmale und Vorteile

A 1-part, medium viscosity, epoxy that is designed to cure at low temperatures to provide excellent adhesion in 5 to 10 minutes.
LOCTITE® 3129 is a 1-part, heat-curable epoxy. It has been specifically designed to cure at low temperatures to provide excellent adhesion on a wide range of materials in under 10 minutes. It’s ideal where low curing temperatures are required for heat sensitive component, for example in memory cards and CCD/CMOS assemblies.
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Technische Informationen

Anzahl Komponenten 1K
Aushärtetechnik Aushärtung durch Wärme
Aushärtezyklus, @ 80.0 °C 5.0 - 10.0 Min.
Casson Viskosität, Kegel-Platte-System Haake PK100, PK1, 2°, @ 25.0 °C 4200.0 mPa.s (cP)
Fließgrenze 39000.0 mPa·s
Lagertemperatur -15.0 - -25.0 °C
Scherfestigkeit 2230.0 psi
Viskosität, Kegel-Platte-System Haake PK100, PK1, 2°, @ 25.0 °C Shear Rate 2 s⁻¹ 46000.0 mPa.s (cP)
Viskosität, Kegel-Platte-System Haake PK100, PK1, 2°, @ 25.0 °C Shear Rate 20 s⁻¹ 12000.0 mPa.s (cP)