LOCTITE® 3129
Merkmale und Vorteile
LOCTITE 3129, Epoxy, Bonding heat sensitive components
LOCTITE® 3129 is a one part, heat curable epoxy. This product is designed to cure at low temperature and gives excellent adhesion on a wide range of materials in considerably short time. Typical applications include Memory cards, CCD/CMOS Assemblies. Particularly suited where low curing temperatures are required for heat sensitive components.
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Technische Informationen
| Anzahl Komponenten | 1K |
| Aushärtetechnik | Aushärtung durch Wärme |
| Aushärtezyklus, @ 80.0 °C | 5.0 - 10.0 Min. |
| Casson Viskosität, Kegel-Platte-System Haake PK100, PK1, 2°, @ 25.0 °C | 4200.0 mPa.s (cP) |
| Fließgrenze | 39000.0 mPa·s |
| Lagertemperatur | -15.0 - -25.0 °C |
| Scherfestigkeit | 2230.0 psi |
| Viskosität, Kegel-Platte-System Haake PK100, PK1, 2°, @ 25.0 °C Shear Rate 2 s⁻¹ | 46000.0 mPa.s (cP) |
| Viskosität, Kegel-Platte-System Haake PK100, PK1, 2°, @ 25.0 °C Shear Rate 20 s⁻¹ | 12000.0 mPa.s (cP) |
LOCTITE® 3129
LOCTITE 3129, Epoxy, Bonding heat sensitive components