LOCTITE® 3129
Elementi i pogodnosti
LOCTITE 3129, Epoxy, Bonding heat sensitive components
LOCTITE® 3129 is a one part, heat curable epoxy. This product is designed to cure at low temperature and gives excellent adhesion on a wide range of materials in considerably short time. Typical applications include Memory cards, CCD/CMOS Assemblies. Particularly suited where low curing temperatures are required for heat sensitive components.
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Dokumenti i preuzimanja
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Tehnički podaci
| Broj komponenti | 1 deo |
| Casson viskoznost, kugla / pločae Haake PK100, PK1, 2°, @ 25.0 °C | 4200.0 mPa.s (cP) |
| Raspored polimerizacije, @ 80.0 °C | 5.0 - 10.0 minuta |
| Sila smicanja | 2230.0 psi |
| Tačka razvlačenja | 39000.0 mPa·s |
| Temperatura čuvanja | -15.0 - -25.0 °C |
| Tip očvršćavanja | Očvršćavanje pomoću zagrevanja |
| Viskoznost, kugla / ploča Haake PK100, PK1, 2°, @ 25.0 °C Shear Rate 2 s⁻¹ | 46000.0 mPa.s (cP) |
| Viskoznost, kugla / ploča Haake PK100, PK1, 2°, @ 25.0 °C Shear Rate 20 s⁻¹ | 12000.0 mPa.s (cP) |
LOCTITE® 3129
LOCTITE 3129, Epoxy, Bonding heat sensitive components