LOCTITE® ABLESTIK QMI536
功能与优点
This 1-part, non-conductive die-attach adhesive is used for attaching integrated circuits and components to advanced substrates.
LOCTITE® ABLESTIK QMI536 is a white, non-conductive die-attach adhesive for attaching integrated circuits and components to advanced substrates, including PBGAs, CSPs, array packages, and stacked die. It’s formulated with a fluoropolymer-filled bismaleimide resin and cures when exposed to heat. It produces a void-free bond line with excellent interfacial strength to various organic and metal surfaces, including solder masks, BT, FR, polyimide, and Au. LOCTITE ABLESTIK QMI536 can be cured in a conventional oven, on a snap-cure oven, or by utilizing SkipCure™ processing on a die or wire bonder. It’s designed to produce cure onset below 212°F (100°C). This can reduce or eliminate the need to pre-dry organic substrates before the die-attach process.
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技术信息
| RT 模剪切强度, 7.6 x 7.6 mm Si die on Ag plated Cu leadframe | 17.0 kg-f |
| 主要特性 | Alpha射线排放：超低Alpha射线排放, 介电, 便于施胶性：优秀, 固化速度：非常快, 应力：应力, 无铅工艺兼容, 模量：低, 粘接力：优秀 |
| 可萃取出的离子含量, 氟化物 (F-) | 20.0 ppm |
| 可萃取出的离子含量, 氯化物 (CI-) | 20.0 ppm |
| 可萃取出的离子含量, 钠 (Na+) | 20.0 ppm |
| 可萃取出的离子含量, 钾 (K+) | 20.0 ppm |
| 固化方式 | 热+紫外线 |
| 外观形态 | 膏状 |
| 密度, Maximum Final | 1.3 g/cm³ |
| 导热性 | 0.3 W/mK |
| 应用 | 芯片焊接 |
| 应用方法 | 加药装置 |
| 推荐与以下物料搭配使用 | 层压材料, 聚酰亚胺 |
| 模量, DMA @ 25.0 °C | 0.3 GPa (300.0 N/mm² , 43500.0 psi ) |
| 热膨胀系数 (CTE) | 98.0 ppm/°C |
| 热膨胀系数 (CTE), Above Tg | 174.0 ppm/°C |
| 玻璃化温度 (Tg) | -31.0 °C |
| 粘度 | 8500.0 mPa.s (cP) |
| 组分数量 | 单组份 |
| 触变指数 | 5.7 |
| 颜色 | 白 |
LOCTITE® ABLESTIK QMI536
This 1-part, non-conductive die-attach adhesive is used for attaching integrated circuits and components to advanced substrates.