LOCTITE® ABLESTIK QMI536
特長および利点
This 1-part, non-conductive die-attach adhesive is used for attaching integrated circuits and components to advanced substrates.
LOCTITE® ABLESTIK QMI536 is a white, non-conductive die-attach adhesive for attaching integrated circuits and components to advanced substrates, including PBGAs, CSPs, array packages, and stacked die. It’s formulated with a fluoropolymer-filled bismaleimide resin and cures when exposed to heat. It produces a void-free bond line with excellent interfacial strength to various organic and metal surfaces, including solder masks, BT, FR, polyimide, and Au. LOCTITE ABLESTIK QMI536 can be cured in a conventional oven, on a snap-cure oven, or by utilizing SkipCure™ processing on a die or wire bonder. It’s designed to produce cure onset below 212°F (100°C). This can reduce or eliminate the need to pre-dry organic substrates before the die-attach process.
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技術情報
| RTダイせん断強度, 7.6 x 7.6 mm Si die on Ag plated Cu leadframe | 17.0 kg-f |
| の使用を推奨 | ポリイミド, ラミネート |
| アプリケーション(用途) | ダイ接着剤 |
| ガラス転移温度 (Tg) | -31.0 °C |
| チクソ性指数 | 5.7 |
| モジュラス, DMA @ 25.0 °C | 0.3 GPa (300.0 N/mm² , 43500.0 psi ) |
| 主成分 | アルファ線放出: 極低アルファ線放出, モジュラス: 低モジュラス, 塗布性: 良好, 応力: 低応力, 接着性: 良好な接着性, 硬化速度: 非常に高速, 絶縁性, 鉛不使用行程適合 |
| 使用方法 | ディスペンス装置 |
| 外観 | ペースト |
| 密度, Maximum Final | 1.3 g/cm³ |
| 形態 | 1液 |
| 抽出可能なイオン含有量, カリウム(K+) | 20.0 ppm |
| 抽出可能なイオン含有量, ナトリウム(Na+) | 20.0 ppm |
| 抽出可能なイオン含有量, フッ化物 (F-) | 20.0 ppm |
| 抽出可能なイオン含有量, 塩化物 (CI-) | 20.0 ppm |
| 熱伝導率 | 0.3 W/mK |
| 熱膨張率 | 98.0 ppm/°C |
| 熱膨張率, Above Tg | 174.0 ppm/°C |
| 硬化タイプ | 熱硬化 |
| 粘度 | 8500.0 mPa.s (cP) |
| 色 | 白 |
LOCTITE® ABLESTIK QMI536
This 1-part, non-conductive die-attach adhesive is used for attaching integrated circuits and components to advanced substrates.