LOCTITE® ABLESTIK QMI536

LOCTITE® ABLESTIK QMI536 is a white, non-conductive die-attach adhesive for attaching integrated circuits and components to advanced substrates, including PBGAs, CSPs, array packages, and stacked die. It’s formulated with a fluoropolymer-filled bismaleimide resin and cures when exposed to heat. It produces a void-free bond line with excellent interfacial strength to various organic and metal surfaces, including solder masks, BT, FR, polyimide, and Au. LOCTITE ABLESTIK QMI536 can be cured in a conventional oven, on a snap-cure oven, or by utilizing SkipCure™ processing on a die or wire bonder. It’s designed to produce cure onset below 212°F (100°C). This can reduce or eliminate the need to pre-dry organic substrates before the die-attach process.