LOCTITE® ABLESTIK QMI536

Features and Benefits

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A white non-conductive die-attach adhesive for attaching integrated circuits and components to advanced substrates.
LOCTITE ABLESTIK QMI536 is a 1-part, white, bismaleimides-based, non-conductive adhesive for attaching integrated circuits and components to advanced substrates, such as PBGAs, CSPs, array packages, and stacked die. It produces a void-free bond line with high interfacial adhesive strength to various organic and metal surfaces, including solder masks, BT, FR, polyimide, and Au. LOCTITE ABLESTIK QMI536 can be cured in a conventional oven, in a snap-cure oven or by utilizing skip-cure processing on a die bonder or wire bonder. It’s fluoropolymer-filled, hydrophobic and stable at high temperatures.
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Technical Data Sheet
LOCTITE® ABLESTIK QMI536
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Technical Information

Application method Dispense system
Applications Die attach
Coefficient of thermal expansion (CTE) 98.0 ppm/°C
Coefficient of thermal expansion (CTE), Above Tg 174.0 ppm/°C
Colour White
Cure type Heat cure
Density, Maximum Final 1.3 g/cm³
Extractable ionic content, Chloride (CI-) 20.0 ppm
Extractable ionic content, Fluoride (F-) 20.0 ppm
Extractable ionic content, Potassium (K+) 20.0 ppm
Extractable ionic content, Sodium (Na+) 20.0 ppm
Glass transition temperature (Tg) -31.0 °C
Key characteristics Adhesion: good adhesion, Alpha emissions: ultra low alpha emissions, Cure speed: very fast, Dielectric, Dispensibility: good dispensibility, Lead free process compatible, Modulus: low modulus, Stress: low stress
Modulus, DMA @ 25.0 °C 0.3 GPa (300.0 N/mm² , 43500.0 psi )
Number of components 1 part
Physical form Paste
RT die shear strength, 7.6 x 7.6 mm Si die on Ag plated Cu leadframe 17.0 kg-f
Recommended for use with Laminate, Polyimide
Thermal conductivity 0.3 W/mK
Thixotropic index 5.7
Viscosity 8500.0 mPa·s (cP)