LOCTITE® ABLESTIK QMI536
功能與優點
A white non-conductive die-attach adhesive for attaching integrated circuits and components to advanced substrates.
LOCTITE ABLESTIK QMI536 is a 1-part, white, bismaleimides-based, non-conductive adhesive for attaching integrated circuits and components to advanced substrates, such as PBGAs, CSPs, array packages, and stacked die. It produces a void-free bond line with high interfacial adhesive strength to various organic and metal surfaces, including solder masks, BT, FR, polyimide, and Au. LOCTITE ABLESTIK QMI536 can be cured in a conventional oven, in a snap-cure oven or by utilizing skip-cure processing on a die bonder or wire bonder. It’s fluoropolymer-filled, hydrophobic and stable at high temperatures.
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技術資訊
| RT 模剪切強度, 7.6 x 7.6 mm Si die on Ag plated Cu leadframe | 17.0 kg-f |
| 使用方法 | 點膠系統 |
| 可萃取出的離子含量, 氟化物(F-) | 20.0 ppm |
| 可萃取出的離子含量, 氯化物(CI-) | 20.0 ppm |
| 可萃取出的離子含量, 鈉(Na+) | 20.0 ppm |
| 可萃取出的離子含量, 鉀(K+) | 20.0 ppm |
| 固化類型 | 熱固化 |
| 密度, Maximum Final | 1.3 g/cm³ |
| 導熱性 | 0.3 W/mK |
| 建議推廣應用 | 層壓, 聚酰亞胺 |
| 應用 | 晶片焊接 |
| 模量, DMA @ 25.0 °C | 0.3 GPa (300.0 N/mm² , 43500.0 psi ) |
| 熱膨脹係數 (CTE) | 98.0 ppm/°C |
| 熱膨脹係數 (CTE), Above Tg | 174.0 ppm/°C |
| 物理形態 | 黏貼 |
| 玻璃化溫度(Tg) | -31.0 °C |
| 觸變指數 | 5.7 |
| 關鍵特性 | 可點膠性：良好的可點膠性, 固化速度：非常快, 應力：低應力, 模量：低模量, 相容無鉛工藝, 阿爾法粒子發射超低阿爾法粒子發射, 電介質, 黏附：良好的附著力 |
| 零組件數 | 1 組分 |
| 顏色 | 白色 |
| 黏度 | 8500.0 mPa.s (cP) |
LOCTITE® ABLESTIK QMI536
A white non-conductive die-attach adhesive for attaching integrated circuits and components to advanced substrates.