LOCTITE® ECCOBOND FP4470
Merkmale und Vorteile
This high-purity epoxy encapsulant has excellent flow properties, so the material can penetrate fine pitch wires and deep cavities without entrapping voids.
LOCTITE® ECCOBOND FP4470 is a high-purity epoxy encapsulant with excellent flow properties, allowing the material to penetrate fine pitch wires and deep cavities without entrapping voids. It can withstand solder reflow after being exposed to JEDEC Level 2A (60°C [140°F] / 60% RH, 120 hours) preconditioning, being a high-adhesion version of LOCTITE ECCOBOND FP4450 for 260°C (500°F) L3 JEDEC performance.
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Technische Informationen
| Aushärtetechnik | Aushärtung durch Wärme |
| Aushärtezyklus, Alternativ @ 165.0 °C | 90.0 Min. |
| Aushärtezyklus, Empfohlen @ 125.0 °C | 30.0 Min. |
| Betriebstemperatur | -65.0 - 150.0 °C |
| Dielektrizitätskonstante, @ 1kHz | 3.5 |
| Farbe | Schwarz |
| Glasübergangstemperatur (Tg) | 148.0 °C |
| Spezifisches Gewicht, @ 25.0 °C | 1.8 |
| Viskosität, Brookfield - RVF, @ 25.0 °C Spindle 6, speed 10 rpm | 42000.0 mPa.s (cP) |
| Volumenwiderstand | 5x10¹⁶ Ohm cm |
| Wärmeausdehnungskoeffizient (CTE), Above Tg | 65.0 ppm/°C |
| Wärmeausdehnungskoeffizient (CTE), Below Tg | 18.0 ppm/°C |
LOCTITE® ECCOBOND FP4470
This high-purity epoxy encapsulant has excellent flow properties, so the material can penetrate fine pitch wires and deep cavities without entrapping voids.