LOCTITE® ECCOBOND FP4470
특징 및 이점
This high-purity epoxy encapsulant has excellent flow properties, so the material can penetrate fine pitch wires and deep cavities without entrapping voids.
LOCTITE® ECCOBOND FP4470 is a high-purity epoxy encapsulant with excellent flow properties, allowing the material to penetrate fine pitch wires and deep cavities without entrapping voids. It can withstand solder reflow after being exposed to JEDEC Level 2A (60°C [140°F] / 60% RH, 120 hours) preconditioning, being a high-adhesion version of LOCTITE ECCOBOND FP4450 for 260°C (500°F) L3 JEDEC performance.
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기술 정보
| 경화 방식 | 열경화 |
| 경화 시간, 권장 @ 125.0 °C | 30.0 분 |
| 경화 시간, 대체품 @ 165.0 °C | 90.0 분 |
| 비중, @ 25.0 °C | 1.8 |
| 색상 | 검정 |
| 열팽창 계수(CTE), Above Tg | 65.0 ppm/°C |
| 열팽창 계수(CTE), Below Tg | 18.0 ppm/°C |
| 유리전이온도(Tg) | 148.0 °C |
| 유전율, @ 1kHz | 3.5 |
| 작동 온도 | -65.0 - 150.0 °C |
| 점도, Brookfield - RVF, @ 25.0 °C Spindle 6, speed 10 rpm | 42000.0 mPa.s (cP) |
| 체적 저항률 | 5x10¹⁶ Ohm cm |
LOCTITE® ECCOBOND FP4470
This high-purity epoxy encapsulant has excellent flow properties, so the material can penetrate fine pitch wires and deep cavities without entrapping voids.