LOCTITE® ECCOBOND FP4470

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This high-purity epoxy encapsulant has excellent flow properties, so the material can penetrate fine pitch wires and deep cavities without entrapping voids.
LOCTITE® ECCOBOND FP4470 is a high-purity epoxy encapsulant with excellent flow properties, allowing the material to penetrate fine pitch wires and deep cavities without entrapping voids. It can withstand solder reflow after being exposed to JEDEC Level 2A (60°C [140°F] / 60% RH, 120 hours) preconditioning, being a high-adhesion version of LOCTITE ECCOBOND FP4450 for 260°C (500°F) L3 JEDEC performance.
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Tehnične informacije

Barva Črna
Delovna temperatura -65.0 - 150.0 °C
Dielektrična konstanta, @ 1kHz 3.5
Koeficient toplotnega raztezanja (CTE), Above Tg 65.0 ppm/°C
Koeficient toplotnega raztezanja (CTE), Below Tg 18.0 ppm/°C
Način strjevanja Strjevanje na podlagi toplote
Prostorninska upornost 5x10¹⁶ Ohm cm
Specifična težnost, @ 25.0 °C 1.8
Temperatura posteklenitve (Tg) 148.0 °C
Urnik strjevanja, Nadomestni @ 165.0 °C 90.0 min.
Urnik strjevanja, Priporočeno @ 125.0 °C 30.0 min.
Viskoznost, Brookfield - RVF, @ 25.0 °C Spindle 6, speed 10 rpm 42000.0 mPa.s (cP)