LOCTITE® ECCOBOND FP4470
Elementi i pogodnosti
This high-purity epoxy encapsulant has excellent flow properties, so the material can penetrate fine pitch wires and deep cavities without entrapping voids.
LOCTITE® ECCOBOND FP4470 is a high-purity epoxy encapsulant with excellent flow properties, allowing the material to penetrate fine pitch wires and deep cavities without entrapping voids. It can withstand solder reflow after being exposed to JEDEC Level 2A (60°C [140°F] / 60% RH, 120 hours) preconditioning, being a high-adhesion version of LOCTITE ECCOBOND FP4450 for 260°C (500°F) L3 JEDEC performance.
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Tehnički podaci
| Boja | Crna |
| Dielektrična konstanta, @ 1kHz | 3.5 |
| Koeficijent toplotnog širenja (CTE), Above Tg | 65.0 ppm/°C |
| Koeficijent toplotnog širenja (CTE), Below Tg | 18.0 ppm/°C |
| Radna temperatura | -65.0 - 150.0 °C |
| Raspored polimerizacije, Alternativa @ 165.0 °C | 90.0 minuta |
| Raspored polimerizacije, Preporučeno @ 125.0 °C | 30.0 minuta |
| Specifična težina, @ 25.0 °C | 1.8 |
| Temperatura razmekšavanja (Tg) | 148.0 °C |
| Tip očvršćavanja | Očvršćavanje pomoću zagrevanja |
| Viskoznost, Brookfield - RVF, @ 25.0 °C Spindle 6, speed 10 rpm | 42000.0 mPa.s (cP) |
| Zapreminska otpornost | 5x10¹⁶ Ohm cm |
LOCTITE® ECCOBOND FP4470
This high-purity epoxy encapsulant has excellent flow properties, so the material can penetrate fine pitch wires and deep cavities without entrapping voids.