LOCTITE® ECCOBOND FP4470
Características e Benefícios
This high-purity epoxy encapsulant has excellent flow properties, so the material can penetrate fine pitch wires and deep cavities without entrapping voids.
LOCTITE® ECCOBOND FP4470 is a high-purity epoxy encapsulant with excellent flow properties, allowing the material to penetrate fine pitch wires and deep cavities without entrapping voids. It can withstand solder reflow after being exposed to JEDEC Level 2A (60°C [140°F] / 60% RH, 120 hours) preconditioning, being a high-adhesion version of LOCTITE ECCOBOND FP4450 for 260°C (500°F) L3 JEDEC performance.
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Informação Técnica
| Coeficiente de expansão térmica (CTE), Above Tg | 65.0 ppm/°C |
| Coeficiente de expansão térmica (CTE), Below Tg | 18.0 ppm/°C |
| Constante dielétrica, @ 1kHz | 3.5 |
| Cor | Preto |
| Cronograma de cura, Alternativo @ 165.0 °C | 90.0 min. |
| Cronograma de cura, Recomendado @ 125.0 °C | 30.0 min. |
| Gravidade específica, @ 25.0 °C | 1.8 |
| Resistividade volumétrica | 5x10¹⁶ Ohm cm |
| Temperatura de operação | -65.0 - 150.0 °C |
| Temperatura de transição do vidro (Tg) | 148.0 °C |
| Tipo de cura | Cura por Calor |
| Viscosidade, Brookfield - RVF, @ 25.0 °C Spindle 6, speed 10 rpm | 42000.0 mPa.s (cP) |
LOCTITE® ECCOBOND FP4470
This high-purity epoxy encapsulant has excellent flow properties, so the material can penetrate fine pitch wires and deep cavities without entrapping voids.