LOCTITE® ECCOBOND FP4470

Features and Benefits

This high-purity epoxy encapsulant has excellent flow properties, so the material can penetrate fine pitch wires and deep cavities without entrapping voids.
LOCTITE® ECCOBOND FP4470 is a high-purity epoxy encapsulant with excellent flow properties, allowing the material to penetrate fine pitch wires and deep cavities without entrapping voids. It can withstand solder reflow after being exposed to JEDEC Level 2A (60°C [140°F] / 60% RH, 120 hours) preconditioning, being a high-adhesion version of LOCTITE ECCOBOND FP4450 for 260°C (500°F) L3 JEDEC performance.
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Technical Information

Coefficient of thermal expansion (CTE), Above Tg 65.0 ppm/°C
Coefficient of thermal expansion (CTE), Below Tg 18.0 ppm/°C
Colour Black
Cure schedule, Alternate @ 165.0 °C 90.0 min.
Cure schedule, Recommended @ 125.0 °C 30.0 min.
Cure type Heat cure
Dielectric constant, @ 1kHz 3.5
Glass transition temperature (Tg) 148.0 °C
Operating temperature -65.0 - 150.0 °C
Specific gravity, @ 25.0 °C 1.8
Viscosity, Brookfield - RVF, @ 25.0 °C Spindle 6, speed 10 rpm 42000.0 mPa·s (cP)
Volume resistivity 5x10¹⁶ Ohm cm