LOCTITE® ECCOBOND FP4470
功能與優點
This high-purity epoxy encapsulant has excellent flow properties, so the material can penetrate fine pitch wires and deep cavities without entrapping voids.
LOCTITE® ECCOBOND FP4470 is a high-purity epoxy encapsulant with excellent flow properties, allowing the material to penetrate fine pitch wires and deep cavities without entrapping voids. It can withstand solder reflow after being exposed to JEDEC Level 2A (60°C [140°F] / 60% RH, 120 hours) preconditioning, being a high-adhesion version of LOCTITE ECCOBOND FP4450 for 260°C (500°F) L3 JEDEC performance.
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技術資訊
| 介電常數, @ 1kHz | 3.5 |
| 固化類型 | 熱固化 |
| 建議固化方式, 可供選擇的 @ 165.0 °C | 90.0 分 |
| 建議固化方式, 推薦的： @ 125.0 °C | 30.0 分 |
| 操作溫度 | -65.0 - 150.0 °C |
| 比重, @ 25.0 °C | 1.8 |
| 熱膨脹係數 (CTE), Above Tg | 65.0 ppm/°C |
| 熱膨脹係數 (CTE), Below Tg | 18.0 ppm/°C |
| 玻璃化溫度(Tg) | 148.0 °C |
| 粘度，Brookfield - RVF, @ 25.0 °C Spindle 6, speed 10 rpm | 42000.0 mPa.s (cP) |
| 顏色 | 黑色 |
| 體積電阻率 | 5x10¹⁶ Ohm cm |
LOCTITE® ECCOBOND FP4470
This high-purity epoxy encapsulant has excellent flow properties, so the material can penetrate fine pitch wires and deep cavities without entrapping voids.