LOCTITE® ECCOBOND FP4470
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This high-purity epoxy encapsulant has excellent flow properties, so the material can penetrate fine pitch wires and deep cavities without entrapping voids.
LOCTITE® ECCOBOND FP4470 is a high-purity epoxy encapsulant with excellent flow properties, allowing the material to penetrate fine pitch wires and deep cavities without entrapping voids. It can withstand solder reflow after being exposed to JEDEC Level 2A (60°C [140°F] / 60% RH, 120 hours) preconditioning, being a high-adhesion version of LOCTITE ECCOBOND FP4450 for 260°C (500°F) L3 JEDEC performance.
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Información técnica
| Coeficiente de dilatación térmica (CDT), Above Tg | 65.0 ppm/°C |
| Coeficiente de dilatación térmica (CDT), Below Tg | 18.0 ppm/°C |
| Color | Negro |
| Constante dieléctrica, @ 1kHz | 3.5 |
| Gravedad específica, @ 25.0 °C | 1.8 |
| Programa de curado, Alternativo @ 165.0 °C | 90.0 min |
| Programa de curado, Recomendado @ 125.0 °C | 30.0 min |
| Resistividad de volumen | 5x10¹⁶ Ohm cm |
| Temperatura de funcionamiento | -65.0 - 150.0 °C |
| Temperatura de transición vítrea (Tg) | 148.0 °C |
| Tipo de curado | Curado Térmico |
| Viscosidad, Brookfield - RVF, @ 25.0 °C Spindle 6, speed 10 rpm | 42000.0 mPa.s (cP) |
LOCTITE® ECCOBOND FP4470
This high-purity epoxy encapsulant has excellent flow properties, so the material can penetrate fine pitch wires and deep cavities without entrapping voids.