LOCTITE® ECCOBOND FP4470

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This high-purity epoxy encapsulant has excellent flow properties, so the material can penetrate fine pitch wires and deep cavities without entrapping voids.
LOCTITE® ECCOBOND FP4470 is a high-purity epoxy encapsulant with excellent flow properties, allowing the material to penetrate fine pitch wires and deep cavities without entrapping voids. It can withstand solder reflow after being exposed to JEDEC Level 2A (60°C [140°F] / 60% RH, 120 hours) preconditioning, being a high-adhesion version of LOCTITE ECCOBOND FP4450 for 260°C (500°F) L3 JEDEC performance.
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Tehniline teave

Dielektriline konstant, @ 1kHz 3.5
Erikaal, @ 25.0 °C 1.8
Klaasistumistemperatuur (Tg) 148.0 °C
Kõvenemisaeg, Alternatiiv @ 165.0 °C 90.0 minut
Kõvenemisaeg, Soovitatav @ 125.0 °C 30.0 minut
Mahu resistiivsus 5x10¹⁶ Ohm cm
Soojuspaisumise koefitsient (CTE), Above Tg 65.0 ppm/°C
Soojuspaisumise koefitsient (CTE), Below Tg 18.0 ppm/°C
Tahkumistüüp Kuumkõvenemine
Töötemperatuur -65.0 - 150.0 °C
Viskoossus, Brookfield - RVF, @ 25.0 °C Spindle 6, speed 10 rpm 42000.0 mPa.s (cP)
Värvus Must