LOCTITE® ABLESTIK ABP 8037TI
功能与优点
This silver-filled die attach adhesive has high thermal conductivity and excellent electrical conductivity, and is perfect for attaching integrated circuits and components.
LOCTITE® ABLESTIK ABP 8037TI is a silver-filled, thermally and electrically conductive, die attach adhesive perfect for use in the attachment of integrated circuits and components onto metal leadframes and advanced substrates. It has excellent adhesive strength and remains stable at high temperatures.
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技术信息
| RT 模剪切强度 | 17.6 kg-f |
| 可萃取出的离子含量, 氯化物 (CI-) | 10.0 ppm |
| 可萃取出的离子含量, 钠 (Na+) | 20.0 ppm |
| 可萃取出的离子含量, 钾 (K+) | 1.0 ppm |
| 固化方式 | 热+紫外线 |
| 应用 | 芯片焊接 |
| 杨氏模量, @ 250.0 °C | 1300.0 N/mm² (188549.0 psi ) |
| 热模剪切强度 | 7.4 kg-f |
| 热膨胀系数 (CTE) | 62.0 ppm/°C |
LOCTITE® ABLESTIK ABP 8037TI
This silver-filled die attach adhesive has high thermal conductivity and excellent electrical conductivity, and is perfect for attaching integrated circuits and components.