LOCTITE® ABLESTIK ABP 8037TI
Features and Benefits
This acrylate-based and silver-filled, conductive die-attach adhesive paste is mainly used for attaching integrated circuits and components.
LOCTITE® ABLESTIK ABP 8037TI is a silver, thermally and electrically conductive die-attach adhesive for attaching integrated circuits and components onto metal lead frames and advanced substrates. It's compatible with a wide array of metals and ceramic surfaces, silver-plated copper and pre-plated lead frames (NiPdAu) and exhibits high stability at high temperatures. It’s formulated with an acrylate-based resin and cures when exposed to heat.
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Technical Information
| Applications | Die attach |
| Coefficient of thermal expansion (CTE) | 62.0 ppm/°C |
| Cure type | Heat cure |
| Extractable ionic content, Chloride (CI-) | 10.0 ppm |
| Extractable ionic content, Potassium (K+) | 1.0 ppm |
| Extractable ionic content, Sodium (Na+) | 20.0 ppm |
| Hot die shear strength | 7.4 kg-f |
| RT die shear strength | 17.6 kg-f |
| Young's modulus, @ 250.0 °C | 1300.0 N/mm² (188549.0 psi ) |
LOCTITE® ABLESTIK ABP 8037TI
This acrylate-based and silver-filled, conductive die-attach adhesive paste is mainly used for attaching integrated circuits and components.