LOCTITE® ABLESTIK ABP 8037TI

Features and Benefits

This silver-filled die attach adhesive has high thermal conductivity and excellent electrical conductivity, and is perfect for attaching integrated circuits and components.
LOCTITE® ABLESTIK ABP 8037TI is a silver-filled, thermally and electrically conductive, die attach adhesive perfect for use in the attachment of integrated circuits and components onto metal leadframes and advanced substrates. It has excellent adhesive strength and remains stable at high temperatures.
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Technical Information

Applications Die attach
Coefficient of thermal expansion (CTE) 62.0 ppm/°C
Cure type Heat cure
Extractable ionic content, Chloride (CI-) 10.0 ppm
Extractable ionic content, Potassium (K+) 1.0 ppm
Extractable ionic content, Sodium (Na+) 20.0 ppm
Hot die shear strength 7.4 kg-f
RT die shear strength 17.6 kg-f
Young's modulus, @ 250.0 °C 1300.0 N/mm² (188549.0 psi )