LOCTITE® ABLESTIK ABP 8037TI
特長および利点
This silver-filled die attach adhesive has high thermal conductivity and excellent electrical conductivity, and is perfect for attaching integrated circuits and components.
LOCTITE® ABLESTIK ABP 8037TI is a silver-filled, thermally and electrically conductive, die attach adhesive perfect for use in the attachment of integrated circuits and components onto metal leadframes and advanced substrates. It has excellent adhesive strength and remains stable at high temperatures.
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技術情報
| RTダイせん断強度 | 17.6 kg-f |
| アプリケーション(用途) | ダイ接着剤 |
| ホットダイせん断強さ | 7.4 kg-f |
| ヤング率, @ 250.0 °C | 1300.0 N/mm² (188549.0 psi ) |
| 抽出可能なイオン含有量, カリウム(K+) | 1.0 ppm |
| 抽出可能なイオン含有量, ナトリウム(Na+) | 20.0 ppm |
| 抽出可能なイオン含有量, 塩化物 (CI-) | 10.0 ppm |
| 熱膨張率 | 62.0 ppm/°C |
| 硬化タイプ | 熱硬化 |
LOCTITE® ABLESTIK ABP 8037TI
This silver-filled die attach adhesive has high thermal conductivity and excellent electrical conductivity, and is perfect for attaching integrated circuits and components.