LOCTITE® ABLESTIK ABP 8037TI
Caractéristiques et avantages
This silver-filled die attach adhesive has high thermal conductivity and excellent electrical conductivity, and is perfect for attaching integrated circuits and components.
LOCTITE® ABLESTIK ABP 8037TI is a silver-filled, thermally and electrically conductive, die attach adhesive perfect for use in the attachment of integrated circuits and components onto metal leadframes and advanced substrates. It has excellent adhesive strength and remains stable at high temperatures.
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Informations techniques
| Applications | Soudage de puce |
| Coefficient de dilatation thermique (CDT) | 62.0 ppm/°C |
| Module de Young, @ 250.0 °C | 1300.0 N/mm² (188549.0 psi ) |
| Résistance au cisaillement puce RT | 17.6 kg-f |
| Résistance au cisaillement puce chaude | 7.4 kg-f |
| Teneur ionique extractible, Chlorure (Cl) | 10.0 ppm |
| Teneur ionique extractible, Potassium (K+) | 1.0 ppm |
| Teneur ionique extractible, Sodium (Na+) | 20.0 ppm |
| Type de polymérisation | Polymérisation par la chaleur |
LOCTITE® ABLESTIK ABP 8037TI
This silver-filled die attach adhesive has high thermal conductivity and excellent electrical conductivity, and is perfect for attaching integrated circuits and components.