LOCTITE® ABLESTIK ABP 8037TI
Features and Benefits
This silver-filled die attach adhesive has high thermal conductivity and excellent electrical conductivity, and is perfect for attaching integrated circuits and components.
LOCTITE® ABLESTIK ABP 8037TI is a silver-filled, thermally and electrically conductive, die attach adhesive perfect for use in the attachment of integrated circuits and components onto metal leadframes and advanced substrates. It has excellent adhesive strength and remains stable at high temperatures.
- High thermal conductivity
- Excellent electrical conductivity
- Excellent adhesive strength
- Stable at high temperatures
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Technical Information
| Applications | Die attach |
| Coefficient of thermal expansion (CTE) | 62.0 ppm/°C |
| Cure type | Heat cure |
| Extractable ionic content, Chloride (CI-) | 10.0 ppm |
| Extractable ionic content, Potassium (K+) | 1.0 ppm |
| Extractable ionic content, Sodium (Na+) | 20.0 ppm |
| Hot die shear strength | 7.4 kg-f |
| RT die shear strength | 17.6 kg-f |
| Young's modulus, @ 250.0 °C | 1300.0 N/mm² (188549.0 psi ) |
LOCTITE® ABLESTIK ABP 8037TI
This silver-filled die attach adhesive has high thermal conductivity and excellent electrical conductivity, and is perfect for attaching integrated circuits and components.