LOCTITE® ABLESTIK ABP 8037TI
Elementi i pogodnosti
This silver-filled die attach adhesive has high thermal conductivity and excellent electrical conductivity, and is perfect for attaching integrated circuits and components.
LOCTITE® ABLESTIK ABP 8037TI is a silver-filled, thermally and electrically conductive, die attach adhesive perfect for use in the attachment of integrated circuits and components onto metal leadframes and advanced substrates. It has excellent adhesive strength and remains stable at high temperatures.
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Dokumenti i preuzimanja
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Tehnički podaci
| Jangov modul, @ 250.0 °C | 1300.0 N/mm² (188549.0 psi ) |
| Jonski sadržaj koji se izvlači, Hlorid (Cl-) | 10.0 ppm |
| Jonski sadržaj koji se izvlači, Kalijum (K+) | 1.0 ppm |
| Jonski sadržaj koji se izvlači, Natrijum (Na+) | 20.0 ppm |
| Koeficijent toplotnog širenja (CTE) | 62.0 ppm/°C |
| Primene | Dodavanje boje |
| Sila smicanja RT kalupa | 17.6 kg-f |
| Sila smicanja vrućeg kalupa | 7.4 kg-f |
| Tip očvršćavanja | Očvršćavanje pomoću zagrevanja |
LOCTITE® ABLESTIK ABP 8037TI
This silver-filled die attach adhesive has high thermal conductivity and excellent electrical conductivity, and is perfect for attaching integrated circuits and components.