LOCTITE® ABLESTIK ABP 8037TI
Lastnosti in prednosti
This silver-filled die attach adhesive has high thermal conductivity and excellent electrical conductivity, and is perfect for attaching integrated circuits and components.
LOCTITE® ABLESTIK ABP 8037TI is a silver-filled, thermally and electrically conductive, die attach adhesive perfect for use in the attachment of integrated circuits and components onto metal leadframes and advanced substrates. It has excellent adhesive strength and remains stable at high temperatures.
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Tehnične informacije
| Izvlečna ionska vsebina, Kalij (K+) | 1.0 ppm |
| Izvlečna ionska vsebina, Klorid (CI-) | 10.0 ppm |
| Izvlečna ionska vsebina, Natrij (Na+) | 20.0 ppm |
| Koeficient toplotnega raztezanja (CTE) | 62.0 ppm/°C |
| Način strjevanja | Strjevanje na podlagi toplote |
| Primeri uporabe | Pritrjevalniki |
| Strižna trdnost RT | 17.6 kg-f |
| Strižna trdnost vročega vtiskovanja | 7.4 kg-f |
| Youngovi moduli, @ 250.0 °C | 1300.0 N/mm² (188549.0 psi ) |
LOCTITE® ABLESTIK ABP 8037TI
This silver-filled die attach adhesive has high thermal conductivity and excellent electrical conductivity, and is perfect for attaching integrated circuits and components.