LOCTITE® ABLESTIK ABP 8037TI
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This silver-filled die attach adhesive has high thermal conductivity and excellent electrical conductivity, and is perfect for attaching integrated circuits and components.
LOCTITE® ABLESTIK ABP 8037TI is a silver-filled, thermally and electrically conductive, die attach adhesive perfect for use in the attachment of integrated circuits and components onto metal leadframes and advanced substrates. It has excellent adhesive strength and remains stable at high temperatures.
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Technische informatie
| Afschuifsterkte RT-matrijs | 17.6 kg-f |
| Afschuifsterkte bij hete matrijs | 7.4 kg-f |
| Coëfficiënt van thermische uitzetting (CTE) | 62.0 ppm/°C |
| Extraheerbare ionische inhoud, Chloride (CI-) | 10.0 ppm |
| Extraheerbare ionische inhoud, Kalium (K+) | 1.0 ppm |
| Extraheerbare ionische inhoud, Natrium (Na+) | 20.0 ppm |
| Toepassingen | Matrijsmontage |
| Uithardingstype | Uitharding door warmte |
| Young's modulus, @ 250.0 °C | 1300.0 N/mm² (188549.0 psi ) |
LOCTITE® ABLESTIK ABP 8037TI
This silver-filled die attach adhesive has high thermal conductivity and excellent electrical conductivity, and is perfect for attaching integrated circuits and components.