LOCTITE® ABLESTIK ABP 8037TI
Vlastnosti a výhody
This acrylate-based and silver-filled, conductive die-attach adhesive paste is mainly used for attaching integrated circuits and components.
LOCTITE® ABLESTIK ABP 8037TI is a silver, thermally and electrically conductive die-attach adhesive for attaching integrated circuits and components onto metal lead frames and advanced substrates. It's compatible with a wide array of metals and ceramic surfaces, silver-plated copper and pre-plated lead frames (NiPdAu) and exhibits high stability at high temperatures. It’s formulated with an acrylate-based resin and cures when exposed to heat.
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Technické informace
| Aplikace | Připevnění formy |
| Extrahovatelný iontový obsah, Chlorid (CI-) | 10.0 ppm |
| Extrahovatelný iontový obsah, Draslík (K+) | 1.0 ppm |
| Extrahovatelný iontový obsah, Sodík (Na+) | 20.0 ppm |
| Koeficient tepelné roztažnosti (CTE) | 62.0 ppm/°C |
| Pevnost ve střihu RT | 17.6 kg-f |
| Pevnost ve střihu za tepla | 7.4 kg-f |
| Youngův modul, @ 250.0 °C | 1300.0 N/mm² (188549.0 psi ) |
| Způsob vytvrzování | Vytvrzování teplem |
LOCTITE® ABLESTIK ABP 8037TI
This acrylate-based and silver-filled, conductive die-attach adhesive paste is mainly used for attaching integrated circuits and components.