LOCTITE® ABLESTIK ABP 8037TI
Merkmale und Vorteile
This silver-filled die attach adhesive has high thermal conductivity and excellent electrical conductivity, and is perfect for attaching integrated circuits and components.
LOCTITE® ABLESTIK ABP 8037TI is a silver-filled, thermally and electrically conductive, die attach adhesive perfect for use in the attachment of integrated circuits and components onto metal leadframes and advanced substrates. It has excellent adhesive strength and remains stable at high temperatures.
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Technische Informationen
| Anwendungen | Gesenk-Verbindung |
| Aushärtetechnik | Aushärtung durch Wärme |
| Elastizitätsmodul, @ 250.0 °C | 1300.0 N/mm² (188549.0 psi ) |
| Extrahierbarer Ionengehalt, Chlorid (CI-) | 10.0 ppm |
| Extrahierbarer Ionengehalt, Kalium (K+) | 1.0 ppm |
| Extrahierbarer Ionengehalt, Natrium (Na+) | 20.0 ppm |
| RT Scherfestigkeit der Matrize | 17.6 kg-f |
| Warmgesenkscherfestigkeit | 7.4 kg-f |
| Wärmeausdehnungskoeffizient (CTE) | 62.0 ppm/°C |
LOCTITE® ABLESTIK ABP 8037TI
This silver-filled die attach adhesive has high thermal conductivity and excellent electrical conductivity, and is perfect for attaching integrated circuits and components.