LOCTITE® ABLESTIK ABP 8037TI
Características y Ventajas
This silver-filled die attach adhesive has high thermal conductivity and excellent electrical conductivity, and is perfect for attaching integrated circuits and components.
LOCTITE® ABLESTIK ABP 8037TI is a silver-filled, thermally and electrically conductive, die attach adhesive perfect for use in the attachment of integrated circuits and components onto metal leadframes and advanced substrates. It has excellent adhesive strength and remains stable at high temperatures.
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Información técnica
| Aplicaciones | Unión |
| Coeficiente de dilatación térmica (CDT) | 62.0 ppm/°C |
| Contenido iónico extraíble, Cloruro (CI-) | 10.0 ppm |
| Contenido iónico extraíble, Potasio (K+) | 1.0 ppm |
| Contenido iónico extraíble, Sodio (Na+) | 20.0 ppm |
| Módulo de Young, @ 250.0 °C | 1300.0 N/mm² (188549.0 psi ) |
| Resistencia al corte a temperatura ambiente | 17.6 kg-f |
| Resistencia al corte con calor | 7.4 kg-f |
| Tipo de curado | Curado Térmico |
LOCTITE® ABLESTIK ABP 8037TI
This silver-filled die attach adhesive has high thermal conductivity and excellent electrical conductivity, and is perfect for attaching integrated circuits and components.