BERGQUIST® GAP PAD TGP 3004SF
Features and Benefits
A high performance, thermally conductive, silicone-free gap pad filler with a thermal conductivity rating of 3.0 W/m-K for silicone sensitive applications.
BERGQUIST® GAP PAD TGP 3004SF is a silicone-free, thermally conductive gap pad. This product exhibits excellent thermal performance and thereby offers exceptionally low interfacial resistance to adjacent surfaces. It has no silicone content, so is ideal for silicone sensitive applications.
- Thermal conductivity: 3.0 W/m-K
- Silicone-free formulation
- UL94 V-0 compliant
- Reworkable
Documents and Downloads
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Additional Documents
Technical Information
| Carrier type | 0.25 mil PET film |
| Color | Light gray |
| Density, Maximum Final | 3.2 g/cm³ |
| Flame rating | V-0 |
| Operating temperature | -40.0 - 125.0 °C |
| Shore hardness, Thirty second delay value, ASTM D2240 Bulk Rubber @ 23.0 °C Shore 00 | 70.0 |
| Standard thickness | 0.254 - 3.715 mm |
| Thermal conductivity | 3.0 W/mK |
BERGQUIST® GAP PAD TGP 3004SF
A high performance, thermally conductive, silicone-free gap pad filler with a thermal conductivity rating of 3.0 W/m-K for silicone sensitive applications.