BERGQUIST® GAP PAD® TGP 3004SF
Žinoma kaip Gap Pad® 3004SF
Savybės ir privalumai
A high performance, thermally conductive, silicone-free gap pad filler with a thermal conductivity rating of 3.0 W/m-K for silicone sensitive applications.
BERGQUIST® GAP PAD TGP 3004SF is a silicone-free, thermally conductive gap pad. This product exhibits excellent thermal performance and thereby offers exceptionally low interfacial resistance to adjacent surfaces. It has no silicone content, so is ideal for silicone sensitive applications.
Aprašymas
Dokumentai ir atsisiuntimai
Ieškote TDL arba SDL kita kalba?
Techniniai duomenys
| Darbinė temperatūra | -40.0 - 125.0 °C |
| Liepsnos įvertinimas | V-0 |
| Nešančiosios medžiagos tipas | 0,25 mil PET plėvelė |
| Spalva | Šviesiai pilka |
| Standartinis storis | 0.254 - 3.715 mm |
| Tankis, Maximum Final | 3.2 g/cm³ |
| Šilumos laidumas | 3.0 W/mK |
| „Shore“ kietumas, Thirty second delay value, ASTM D2240 Birioji guma @ 23.0 °C Shore 00 | 70.0 |
BERGQUIST® GAP PAD® TGP 3004SF
A high performance, thermally conductive, silicone-free gap pad filler with a thermal conductivity rating of 3.0 W/m-K for silicone sensitive applications.