BERGQUIST® GAP PAD TGP 3004SF
Conhecido como Gap Pad® 3004SF
Características e Benefícios
A high performance, thermally conductive, silicone-free gap pad filler with a thermal conductivity rating of 3.0 W/m-K for silicone sensitive applications.
BERGQUIST® GAP PAD TGP 3004SF is a silicone-free, thermally conductive gap pad. This product exhibits excellent thermal performance and thereby offers exceptionally low interfacial resistance to adjacent surfaces. It has no silicone content, so is ideal for silicone sensitive applications.
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Informação Técnica
| Classificação da chama | V-0 |
| Condutividade térmica | 3.0 W/mK |
| Cor | Cinza-claro |
| Densidade, Maximum Final | 3.2 g/cm³ |
| Dureza shore, Thirty second delay value, ASTM D2240 Borracha à granel @ 23.0 °C Shore 00 | 70.0 |
| Espessura padrão | 0.254 - 3.715 mm |
| Temperatura de operação | -40.0 - 125.0 °C |
| Tipo de operadora | Filme PET de 0,25 mil |
BERGQUIST® GAP PAD TGP 3004SF
A high performance, thermally conductive, silicone-free gap pad filler with a thermal conductivity rating of 3.0 W/m-K for silicone sensitive applications.