BERGQUIST® GAP PAD® TGP 3004SF

Zināms kā Gap Pad® 3004SF

Iezīmes un ieguvumi

A high performance, thermally conductive, silicone-free gap pad filler with a thermal conductivity rating of 3.0 W/m-K for silicone sensitive applications.
BERGQUIST® GAP PAD TGP 3004SF is a silicone-free, thermally conductive gap pad. This product exhibits excellent thermal performance and thereby offers exceptionally low interfacial resistance to adjacent surfaces. It has no silicone content, so is ideal for silicone sensitive applications.
Apraksts

Tehniskā informācija

Blīvums, Maximum Final 3.2 g/cm³
Cietība, Thirty second delay value, ASTM D2240 Lielgabarīta gumija @ 23.0 °C Shore 00 70.0
Darbības temperatūra -40.0 - 125.0 °C
Krāsa Viegli aptumšots
Liesmas novērtējums V-0
Nesēja veids 0,25 mil PET plēve
Siltumvadītspēja 3.0 W/mK
Standarta biezums 0.254 - 3.715 mm