BERGQUIST® GAP PAD® TGP 3004SF
Známe ako Gap Pad® 3004SF
Vlastnosti a výhody
A high-performance, thermally conductive, silicone-free GAP PAD filler with a thermal conductivity rating of 3.0 W/m-K for silicone sensitive applications.
BERGQUIST® GAP PAD® TGP 3004SF is a silicone-free, thermally conductive gap pad. This product exhibits excellent thermal performance and thereby offers exceptionally low interfacial resistance to adjacent surfaces. It has no silicone content, so is ideal for silicone sensitive applications.
Viac info
Dokumenty na prevzatie
Hľadáte TL alebo KBÚ v inom jazyku
Technické informácie
| Farba | Svetlosivá |
| Hodnotenie horľavosti | V-0 |
| Hustota, Maximum Final | 3.2 g/cm³ |
| Prevádzková teplota | -40.0 - 125.0 °C |
| Tepelná vodivosť | 3.0 W/mK |
| Tvrdosť v jednotke Shore, Thirty second delay value, ASTM D2240 Sypká guma @ 23.0 °C Shore 00 | 70.0 |
| Typ nosiča | 0,25 mil PET film |
| Štandardná hrúbka | 0.254 - 3.715 mm |
BERGQUIST® GAP PAD® TGP 3004SF
A high-performance, thermally conductive, silicone-free GAP PAD filler with a thermal conductivity rating of 3.0 W/m-K for silicone sensitive applications.