BERGQUIST® GAP PAD® TGP 3004SF

Známe ako Gap Pad® 3004SF

Vlastnosti a výhody

A high performance, thermally conductive, silicone-free gap pad filler with a thermal conductivity rating of 3.0 W/m-K for silicone sensitive applications.
BERGQUIST® GAP PAD TGP 3004SF is a silicone-free, thermally conductive gap pad. This product exhibits excellent thermal performance and thereby offers exceptionally low interfacial resistance to adjacent surfaces. It has no silicone content, so is ideal for silicone sensitive applications.
Viac info

Technické informácie

Farba Svetlosivá
Hodnotenie horľavosti V-0
Hustota, Maximum Final 3.2 g/cm³
Prevádzková teplota -40.0 - 125.0 °C
Tepelná vodivosť 3.0 W/mK
Tvrdosť v jednotke Shore, Thirty second delay value, ASTM D2240 Sypká guma @ 23.0 °C Shore 00 70.0
Typ nosiča 0,25 mil PET film
Štandardná hrúbka 0.254 - 3.715 mm