BERGQUIST® GAP PAD® TGP 3004SF
Poznano kot Gap Pad® 3004SF
Lastnosti in prednosti
A high-performance, thermally conductive, silicone-free GAP PAD filler with a thermal conductivity rating of 3.0 W/m-K for silicone sensitive applications.
BERGQUIST® GAP PAD® TGP 3004SF is a silicone-free, thermally conductive gap pad. This product exhibits excellent thermal performance and thereby offers exceptionally low interfacial resistance to adjacent surfaces. It has no silicone content, so is ideal for silicone sensitive applications.
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Tehnične informacije
| Barva | Svetlo siva |
| Delovna temperatura | -40.0 - 125.0 °C |
| Gostota, Maximum Final | 3.2 g/cm³ |
| Ocena plamena | V-0 |
| Standardna debelina | 0.254 - 3.715 mm |
| Toplotna prevodnost | 3.0 W/mK |
| Trdota po Shoru, Thirty second delay value, ASTM D2240 Razsuta guma @ 23.0 °C Shore 00 | 70.0 |
| Vrsta nosilca | 0,25 mil poliestrske folije |
BERGQUIST® GAP PAD® TGP 3004SF
A high-performance, thermally conductive, silicone-free GAP PAD filler with a thermal conductivity rating of 3.0 W/m-K for silicone sensitive applications.