BERGQUIST® GAP PAD® TGP 3004SF

Poznano kot Gap Pad® 3004SF

Lastnosti in prednosti

A high performance, thermally conductive, silicone-free gap pad filler with a thermal conductivity rating of 3.0 W/m-K for silicone sensitive applications.
BERGQUIST® GAP PAD TGP 3004SF is a silicone-free, thermally conductive gap pad. This product exhibits excellent thermal performance and thereby offers exceptionally low interfacial resistance to adjacent surfaces. It has no silicone content, so is ideal for silicone sensitive applications.
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Tehnične informacije

Barva Svetlo siva
Delovna temperatura -40.0 - 125.0 °C
Gostota, Maximum Final 3.2 g/cm³
Ocena plamena V-0
Standardna debelina 0.254 - 3.715 mm
Toplotna prevodnost 3.0 W/mK
Trdota po Shoru, Thirty second delay value, ASTM D2240 Razsuta guma @ 23.0 °C Shore 00 70.0
Vrsta nosilca 0,25 mil poliestrske folije