BERGQUIST® GAP PAD® TGP 3004SF
Poznat kao Gap Pad® 3004SF
Elementi i pogodnosti
A high performance, thermally conductive, silicone-free gap pad filler with a thermal conductivity rating of 3.0 W/m-K for silicone sensitive applications.
BERGQUIST® GAP PAD TGP 3004SF is a silicone-free, thermally conductive gap pad. This product exhibits excellent thermal performance and thereby offers exceptionally low interfacial resistance to adjacent surfaces. It has no silicone content, so is ideal for silicone sensitive applications.
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Tehnički podaci
| Boja | Svetlo siva |
| Gustina, Maximum Final | 3.2 g/cm³ |
| Otpornost na plamen | V-0 |
| Radna temperatura | -40.0 - 125.0 °C |
| Standardna debljina | 0.254 - 3.715 mm |
| Tip nosača | PET premaz, 0,25 mil |
| Toplotna provodljivost | 3.0 W/mK |
| Tvrdoća po Šoru, Thirty second delay value, ASTM D2240 Guma u komadu @ 23.0 °C Shore 00 | 70.0 |
BERGQUIST® GAP PAD® TGP 3004SF
A high performance, thermally conductive, silicone-free gap pad filler with a thermal conductivity rating of 3.0 W/m-K for silicone sensitive applications.