BERGQUIST® GAP PAD® TGP 3004SF
Známé jako Gap Pad® 3004SF
Vlastnosti a výhody
A high-performance, thermally conductive, silicone-free GAP PAD filler with a thermal conductivity rating of 3.0 W/m-K for silicone sensitive applications.
BERGQUIST® GAP PAD® TGP 3004SF is a silicone-free, thermally conductive gap pad. This product exhibits excellent thermal performance and thereby offers exceptionally low interfacial resistance to adjacent surfaces. It has no silicone content, so is ideal for silicone sensitive applications.
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Technické informace
| Barva | Světle šedá |
| Hodnocení hořlavosti | V-0 |
| Hustota, Maximum Final | 3.2 g/cm³ |
| Provozní teplota | -40.0 - 125.0 °C |
| Standardní tloušťka | 0.254 - 3.715 mm |
| Tepelná vodivost | 3.0 W/mK |
| Tvrdost v jednotce shore, Thirty second delay value, ASTM D2240 Sypká pryž @ 23.0 °C Shore 00 | 70.0 |
| Typ přepravce | Vrstva PET 0,25 mil |
BERGQUIST® GAP PAD® TGP 3004SF
A high-performance, thermally conductive, silicone-free GAP PAD filler with a thermal conductivity rating of 3.0 W/m-K for silicone sensitive applications.