BERGQUIST® GAP PAD® TGP 3004SF
Tuntud kui Gap Pad® 3004SF
Omadused ja eelised
A high performance, thermally conductive, silicone-free gap pad filler with a thermal conductivity rating of 3.0 W/m-K for silicone sensitive applications.
BERGQUIST® GAP PAD TGP 3004SF is a silicone-free, thermally conductive gap pad. This product exhibits excellent thermal performance and thereby offers exceptionally low interfacial resistance to adjacent surfaces. It has no silicone content, so is ideal for silicone sensitive applications.
Lugege rohkem
Dokumendid ja allalaadimised
Otsite TDS-i või SDS-i teises keeles?
Tehniline teave
| Arvestuslik leegikindlus | V-0 |
| Kanduri tüüp | 0,25 mil PET-kile |
| Shore’i kõvadus, Thirty second delay value, ASTM D2240 Puistkumm @ 23.0 °C Shore 00 | 70.0 |
| Soojusjuhtivus | 3.0 W/mK |
| Standardpaksus | 0.254 - 3.715 mm |
| Tihedus, Maximum Final | 3.2 g/cm³ |
| Töötemperatuur | -40.0 - 125.0 °C |
| Värvus | Helehall |
BERGQUIST® GAP PAD® TGP 3004SF
A high performance, thermally conductive, silicone-free gap pad filler with a thermal conductivity rating of 3.0 W/m-K for silicone sensitive applications.