BERGQUIST® GAP PAD® TGP 3004SF
Bekend als Gap Pad® 3004SF
Kenmerken en voordelen
A high-performance, thermally conductive, silicone-free GAP PAD filler with a thermal conductivity rating of 3.0 W/m-K for silicone sensitive applications.
BERGQUIST® GAP PAD® TGP 3004SF is a silicone-free, thermally conductive gap pad. This product exhibits excellent thermal performance and thereby offers exceptionally low interfacial resistance to adjacent surfaces. It has no silicone content, so is ideal for silicone sensitive applications.
Meer info
Documenten en downloads
Op zoek naar een TDS of MSDS in een andere taal?
Technische informatie
| Dichtheid, Maximum Final | 3.2 g/cm³ |
| Gebruikstemperatuur | -40.0 - 125.0 °C |
| Kleur | Lichtgrijs |
| Shore hardheid, Thirty second delay value, ASTM D2240 Bulk Rubber @ 23.0 °C Shore 00 | 70.0 |
| Standaard dikte | 0.254 - 3.715 mm |
| Thermische geleidbaarheid | 3.0 W/mK |
| Type drager | 0,25 mil PET-folie |
| Vlammenclassificatie | V-0 |
BERGQUIST® GAP PAD® TGP 3004SF
A high-performance, thermally conductive, silicone-free GAP PAD filler with a thermal conductivity rating of 3.0 W/m-K for silicone sensitive applications.