LOCTITE® ABLESTIK 8387B
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This black non-conductive adhesive is designed for optoelectronic devices in aerospace and defence devices.
LOCTITE® ABLESTIK 8387B is a black, non-conductive epoxy adhesive for high-throughput die-attach applications. It’s particularly used for glass attachment to optical and 3D sensors in aerospace and defence applications. It cures fast when exposed to direct heat energy or hot-plate techniques. In conventional box- or convection conveyor oven curing, it will cure at temperatures as low as 100°C (212°F). If cured properly, it should pass the NASA outgassing standards.
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Tehniline teave
| Ekstraheeritav ioonisisu, Kaalium (K+) | 4.0 ppm |
| Ekstraheeritav ioonisisu, Kloriid (CI-) | 299.0 ppm |
| Ekstraheeritav ioonisisu, Naatrium (Na+) | 9.0 ppm |
| Füüsiline vorm | Pasta |
| Klaasistumistemperatuur (Tg) | 96.0 °C |
| Komponentide arv | 1-komponentne |
| Kuumlõike nihkejõud, @ 250.0 °C 12.7 x 12.7 mm Si die on Cu LF | 270.0 kg-f |
| Kõvenemisaeg, @ 150.0 °C | 2.0 minut |
| Pealekandmismeetod | Doseerimissüsteem |
| Peamised omadused | Juhtivus: Elektrit mitte-juhtiv, Tahkumiskiirus: Kiire |
| RT kuumlõike nihkejõud, 3 x 3 mm Si die on Cu LF @ 25°C | 4400.0 psi |
| Rakendused | Stantskinnitus |
| Soojuspaisumise koefitsient (CTE) | 94.0 ppm/°C |
| Soojuspaisumise koefitsient (CTE), Above Tg | 165.0 ppm/°C |
| Soovitatav kasutada koos | Juhtmekorpus: hõbe, Laminaat |
| Tahkumistüüp | Kuumkõvenemine |
| Tiksotroopne indeks | 4.5 |
| Tõmbemoodul, DMTA @ 250.0 °C | 53.0 N/mm² (7700.0 psi ) |
| Viskoossus, Brookfield CP51, @ 25.0 °C Speed 5 rpm | 9500.0 mPa.s (cP) |
| Värvus | Must |
LOCTITE® ABLESTIK 8387B
This black non-conductive adhesive is designed for optoelectronic devices in aerospace and defence devices.