LOCTITE® ABLESTIK 8387B
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This black non-conductive adhesive is designed for optoelectronic devices in aerospace and defence devices.
LOCTITE® ABLESTIK 8387B is a black, non-conductive epoxy adhesive for high-throughput die attach applications. It's particularly used for glass attachment to optical and 3D sensors in aerospace and defence applications. It cures fast when exposed to direct heat energy or hot-plate techniques. In conventional box or convection conveyor oven curing, it will cure at temperatures as low as 100ºC (212ºF). If cured properly, it should pass the NASA outgassing standards.
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Tehniline teave
| Ekstraheeritav ioonisisu, Kaalium (K+) | 4.0 ppm |
| Ekstraheeritav ioonisisu, Kloriid (CI-) | 299.0 ppm |
| Ekstraheeritav ioonisisu, Naatrium (Na+) | 9.0 ppm |
| Füüsiline vorm | Pasta |
| Klaasistumistemperatuur (Tg) | 96.0 °C |
| Komponentide arv | 1-komponentne |
| Kuumlõike nihkejõud, @ 250.0 °C 12.7 x 12.7 mm Si die on Cu LF | 270.0 kg-f |
| Kõvenemisaeg, @ 150.0 °C | 2.0 minut |
| Pealekandmismeetod | Doseerimissüsteem |
| Peamised omadused | Juhtivus: Elektrit mitte-juhtiv, Tahkumiskiirus: Kiire |
| RT kuumlõike nihkejõud, 3 x 3 mm Si die on Cu LF @ 25°C | 4400.0 psi |
| Rakendused | Stantskinnitus |
| Soojuspaisumise koefitsient (CTE) | 94.0 ppm/°C |
| Soojuspaisumise koefitsient (CTE), Above Tg | 165.0 ppm/°C |
| Soovitatav kasutada koos | Juhtmekorpus: hõbe, Laminaat |
| Tahkumistüüp | Kuumkõvenemine |
| Tiksotroopne indeks | 4.5 |
| Tõmbemoodul, DMTA @ 250.0 °C | 53.0 N/mm² (7700.0 psi ) |
| Viskoossus, Brookfield CP51, @ 25.0 °C Speed 5 rpm | 9500.0 mPa.s (cP) |
| Värvus | Must |
LOCTITE® ABLESTIK 8387B
This black non-conductive adhesive is designed for optoelectronic devices in aerospace and defence devices.