LOCTITE® ABLESTIK 8387B
功能與優點
A black non-conductive adhesive for optoelectronic devices in aerospace and defence devices.
LOCTITE® ABLESTIK 8387B is a black non-conductive epoxy adhesive for high-throughput die attach applications. It's particularly used for glass attachment to optical and 3D sensors in aerospace and defence applications. It cures fast when exposed to direct heat energy or hot-plate techniques. In conventional box or convection conveyor oven curing, it will cure at temperatures as low as 100ºC (212ºF). If cured properly, it should pass the NASA outgassing standards.
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技術資訊
| RT 模剪切強度, 3 x 3 mm Si die on Cu LF @ 25°C | 4400.0 psi |
| 使用方法 | 點膠系統 |
| 可萃取出的離子含量, 氯化物(CI-) | 299.0 ppm |
| 可萃取出的離子含量, 鈉(Na+) | 9.0 ppm |
| 可萃取出的離子含量, 鉀(K+) | 4.0 ppm |
| 固化類型 | 熱固化 |
| 建議固化方式, @ 150.0 °C | 2.0 分 |
| 建議推廣應用 | 導線架：銀, 層壓 |
| 應用 | 晶片焊接 |
| 拉伸模量, DMTA @ 250.0 °C | 53.0 N/mm² (7700.0 psi ) |
| 熱模剪切強度, @ 250.0 °C 12.7 x 12.7 mm Si die on Cu LF | 270.0 kg-f |
| 熱膨脹係數 (CTE) | 94.0 ppm/°C |
| 熱膨脹係數 (CTE), Above Tg | 165.0 ppm/°C |
| 物理形態 | 黏貼 |
| 玻璃化溫度(Tg) | 96.0 °C |
| 粘度，Brookfield CP51, @ 25.0 °C Speed 5 rpm | 9500.0 mPa.s (cP) |
| 觸變指數 | 4.5 |
| 關鍵特性 | 固化速度：快速固化, 導電性：不導電 |
| 零組件數 | 1 組分 |
| 顏色 | 黑色 |
LOCTITE® ABLESTIK 8387B
A black non-conductive adhesive for optoelectronic devices in aerospace and defence devices.