LOCTITE® ABLESTIK 8387B
Features and Benefits
slide 1 of 1
This black non-conductive adhesive is designed for optoelectronic devices in aerospace and defence devices.
LOCTITE® ABLESTIK 8387B is a black, non-conductive epoxy adhesive for high-throughput die-attach applications. It’s particularly used for glass attachment to optical and 3D sensors in aerospace and defence applications. It cures fast when exposed to direct heat energy or hot-plate techniques. In conventional box- or convection conveyor oven curing, it will cure at temperatures as low as 100°C (212°F). If cured properly, it should pass the NASA outgassing standards.
Read More
Documents and Downloads
Looking for a TDS or SDS in another language?
Technical Information
| Application method | Dispense system |
| Applications | Die attach |
| Coefficient of thermal expansion (CTE) | 94.0 ppm/°C |
| Coefficient of thermal expansion (CTE), Above Tg | 165.0 ppm/°C |
| Colour | Black |
| Cure schedule, @ 150.0 °C | 2.0 min. |
| Cure type | Heat cure |
| Extractable ionic content, Chloride (CI-) | 299.0 ppm |
| Extractable ionic content, Potassium (K+) | 4.0 ppm |
| Extractable ionic content, Sodium (Na+) | 9.0 ppm |
| Glass transition temperature (Tg) | 96.0 °C |
| Hot die shear strength, @ 250.0 °C 12.7 x 12.7 mm Si die on Cu LF | 270.0 kg-f |
| Key characteristics | Conductivity: electrically non-conductive, Cure speed: fast cure |
| Number of components | 1 part |
| Physical form | Paste |
| RT die shear strength, 3 x 3 mm Si die on Cu LF @ 25°C | 4400.0 psi |
| Recommended for use with | Laminate, LeadFrame: silver |
| Tensile modulus, DMTA @ 250.0 °C | 53.0 N/mm² (7700.0 psi ) |
| Thixotropic index | 4.5 |
| Viscosity, Brookfield CP51, @ 25.0 °C Speed 5 rpm | 9500.0 mPa·s (cP) |
LOCTITE® ABLESTIK 8387B
This black non-conductive adhesive is designed for optoelectronic devices in aerospace and defence devices.